AMEC buys control of CMP specialist Sizone, backed by US$206.3M raise
What's the deal? Advanced Micro-Fabrication Equipment Inc. China (AMEC) is acquiring a 64.69% controlling stake in Hangzhou Sizone (Zhonggui) for US$216.7M, paid through a mix of share issuance and cash. On 7 July 2026, AMEC said it had completed the supporting financing phase, raising nearly US$206.3M.
The terms: Sizone's full equity was appraised at US$343.9M and set at US$334.9M after negotiation. AMEC bought the stake from 41 counterparties, including Hangzhou Zhongxingui and Lin'an Zhongxingui, and will fold Sizone into its consolidated accounts as a controlled subsidiary.
The financing: AMEC placed 5.1568 million new shares at US$40 each with four investors, raising about US$206.1M. The shares are restricted and unlock in batches. Funds go to Sizone's R&D and industrialization centre, the cash portion of the deal, and working capital.
What's the endgame? Sizone makes high-end chemical mechanical polishing (CMP) equipment and is one of the few Chinese firms to reach mass production of 12-inch high-end CMP tools. CMP is a core wet process in front-end chip manufacturing — and a gap in AMEC's line-up, which has centred on dry processes such as plasma etching and thin film deposition.
Why now? The deal marks AMEC's first controlling-stake acquisition via share issuance in over two decades, a step it framed as advancing its platform strategy. Sizone's tools span 8-inch and 12-inch wafers and address logic chips, memory, silicon wafers, and silicon carbide substrates.
The signal: The purchase reflects China's push to build a domestic semiconductor equipment stack and reduce reliance on overseas suppliers. By adding CMP to etching and deposition, AMEC widens its role across the front-end toolchain — consolidating homegrown capability under a single listed platform.
Read more: WeDoAny
Image credit: Onri Jay Benally
