Sizone Technology

Sizone Technology, officially Hangzhou Sizone Electronic Technology Inc., is a developer and manufacturer of advanced Chemical Mechanical Planarization (CMP) equipment for the semiconductor industry. The company was founded in 2018 in Hangzhou, China, by experts from Silicon Valley with extensive experience in the semiconductor equipment field. Dr. GU, Haiyang serves as the company's Chairman.

Sizone Technology focuses on the research, development, production, and sales of integrated circuit intelligent equipment. Its core products are CMP and Electrochemical Mechanical Polishing (ECMP) equipment, available in various sizes (6-inch, 8-inch, and 12-inch) to meet different manufacturing needs. These products are crucial for integrated circuit manufacturing, silicon wafer production, and third-generation semiconductor manufacturing. The company also provides related products like dual module systems, slurry delivery systems, and slurry distribution devices, alongside technical support and services.

The company's business model is centered on generating revenue through the sale of its specialized semiconductor manufacturing equipment. It serves chip makers and other high-tech fields. Since its inception, Sizone has secured significant funding through multiple venture capital rounds, attracting at least 17 investors, including An Hui Wenergy Company, Fortune Capital, and Zhongxin Fund. The company is privately held and venture capital-backed, with a recent Series B1 funding round completed in February 2025.

Keywords: Chemical Mechanical Planarization, CMP equipment, semiconductor manufacturing, ECMP equipment, integrated circuit equipment, wafer planarization, polishing equipment, silicon wafer production, advanced manufacturing, semiconductor technology, Hangzhou