SiChip Micro raises $30M Series B for advanced chip packaging
What's the deal? Chinese semiconductor firm SiChip MicroDealroom has a profile for this one. Try Dealroom → has raised US$27.5M (roughly $30 million) in a Series B round, the company announced in September 2026. The round was jointly backed by Hubei state-owned assets, Zhejiang state-owned assets, and chipmaker NCE PowerDealroom has a profile for this one. Try Dealroom →.
What's the endgame? SiChip Micro is a CXO company focused on advanced semiconductor packaging. It provides bundled research, development, and volume-manufacturing services — spanning next-generation mid-end packaging processes, materials, and equipment — under CRO, CDO, and CDMO models.
Who does it serve? The company counts more than 100 leading domestic and international clients. Its customer base spans major IDM companies, foundries, product firms, fabless designers, and packaging-and-testing houses.
The signal: The mix of state-backed investors from Hubei and Zhejiang alongside strategic backer NCE Power points to China's continued push to build out its domestic chip supply chain, with advanced packaging a growing focus as an alternative route to performance gains.
Image credit: IBM Research
