Qingdao New Core Technology

About Qingdao New Core Technology

Kore Semiconductor Co., Ltd., also known as Qingdao New Core Technology, is a specialized entity in the semiconductor sector, concentrating on advanced packaging and testing solutions. Established in 2020 by its parent company, Foxconn, the firm operates within the burgeoning technology hub of Qingdao, China. This strategic location is part of a broader initiative to build up the region's integrated circuit industry.

The company's business model is centered on providing comprehensive outsourced semiconductor assembly and test (OSAT) services. Kore Semiconductor offers state-of-the-art wafer-level and fan-out packaging, presenting a total solution that includes both packaging and testing. Its service portfolio encompasses wafer bumping, assembly, and various test services. The firm serves clients within the semiconductor industry that require these critical back-end processes to complete their product manufacturing cycles. By leveraging the extensive resources and manufacturing expertise of the Foxconn group, Kore Semiconductor aims to deliver a complete and integrated service package.

Financially, the company has attracted significant investment to fuel its operations and growth. In a notable funding event on March 17, 2024, Kore Semiconductor received CNY 100 million from Foxconn Industrial Internet, an affiliate of its parent company. This investment underscores the strategic importance of the venture within the Foxconn ecosystem and provides substantial capital for scaling its advanced packaging and testing capabilities.