Optical Interconnect Technology

About Optical Interconnect Technology

Optical Interconnect Technology develops and manufactures optical interconnect solutions designed to address the increasing bandwidth and power consumption challenges in AI data centers. The company's technology is protocol-agnostic, supporting standards like Ethernet, PCIe, and CXL, which allows for compute, memory, and storage disaggregation and enables flatter networking architectures with lower latency.

The core product is a 400-Gbps near-packaged optical interconnect that is soldered at the PCB level, an approach that differs from co-packaged optics (CPO) architectures where optical components are integrated directly into the ASIC package. This design aims to simplify system complexity and thermal management. The component is a compact system-in-package (SiP) that integrates lasers, photodetectors, microcontrollers, driver ICs, and transimpedance amplifiers, consuming approximately 2W of power. The primary benefit is an increase in bandwidth density while reducing the power consumption associated with networking inside AI racks.

The market for optical interconnects is driven by the rapid expansion of cloud computing and AI, which demand higher bandwidth, faster data transfer, lower latency, and reduced power consumption compared to traditional copper wiring. As data rates increase, conventional copper traces face issues with signal degradation and thermal challenges, which optical solutions can mitigate. Optical Interconnect Technology's approach allows for a dense, one-to-many networking capability without a heavy reliance on switches, facilitating faster communication in distributed computing systems. The company demonstrated its compute disaggregation capabilities at the 2026 Optical Fiber Communications Conference.