LIDROTEC

About LIDROTEC

LIDROTEC develops laser-based equipment for wafer dicing, the precision cutting of microchips and devices. Its liquid-assisted laser technology combines ultrashort laser pulses with a controlled fluid stream. The liquid cools the workpiece, rinses away debris and improves the ablation process. Results include burr-free sharp cut edges, narrow cut widths and higher aspect ratios, increasing chips per wafer, reducing waste and removing the need for coating or post-processing. The machines combine scribing, dicing and structuring in one step, are built for cleanroom environments and include a SECS/GEM interface for factory integration. LIDROTEC primarily serves semiconductor manufacturers, and the technology also applies to energy, medical, electronics and materials sectors. Founded in 2019 in Bochum, Germany, the company partnered with TRUMPF in 2026 to bring laser dicing to mass-production scale, cutting wafers more than three times faster than mechanical sawing while preserving edge quality.