Skylink raises $3.91M in debt to grow its lending book
What's the deal? Singapore-listed SkylinkDealroom has a profile for this one. Try Dealroom → Holdings has raised US$3.67M through a private issue of unlisted, non-convertible and non-transferable bonds. The bonds were issued on October 19, 2026, to investors who are not company directors or interested persons, leaving existing shareholders undiluted.
The terms: The two-year bonds carry an 8% coupon and are denominated at US$183.3K, in integral multiples of US$36.7K thereafter. Skylink plans to use the proceeds to grow its hire-purchase loan book.
Why now? The raise follows a US$5.15M share placement in February, making it a quick return to the funding market. Skylink says a full subscription could support at least US$22M of additional lending, building on a US$48.6M loan book at March 2026.
What's the endgame? The company is shifting toward higher-yield originations. The move is a targeted bet on growth, not proof that lending has already lifted results: FY2026 credit revenue slipped 4.5% to US$2.64M amid early repayments and the run-off of older loans.
What could go wrong? The 8% coupon is a meaningful financing cost. That makes loan yields, execution, and credit quality the key metrics to watch as Skylink deploys the capital.
The signal: For a small-cap on the Catalist board, tapping private debt twice in under a year shows continued access to funding — but it also raises the stakes on turning fresh capital into profitable lending.
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