Wushi Microelectronics raises $14.9M Series A for wafer bonding tools
What's the deal? Wushi MicroelectronicsDealroom has a profile for this one. Try Dealroom →, a Chinese semiconductor equipment maker, has raised US$13.8M (roughly $14.9 million) in a Series A round. The financing drew a group of investors led by Wuyuefeng Capital, GL VenturesDealroom has a profile for this one. Try Dealroom →, Shenzhen Capital Group, Suzhou Venture Capital Angel Fund of Funds, and Tiantang Silicon Valley.
What's the endgame? The company develops and sells wafer-level temporary bonding and debonding equipment, as well as permanent bonding systems. It aims to offer global semiconductor clients a one-stop set of system solutions.
Who else is in? Pre-A backers Optics Valley Industrial Investment and Suzhou Industrial Park Sci-Tech Innovation Fund returned to add further capital beyond their earlier stakes.
The signal: At roughly $14.9 million, the round sits in the 64th percentile by deal size — a solid but mid-tier raise. The breadth of state-linked and private backers reflects continued investor appetite for China's domestic chip-equipment supply chain.
Read more: itjuzi.com
Image credit: IBM Research
