AnyCasting raises $5.4M seed to build glass substrate plating line in South Korea
What's the deal? AnyCasting SoftwareDealroom has a profile for this one. Try Dealroom →, a South Korean semiconductor glass substrate plating company, has raised US$6.29M in a seed round. POSCO Technology InvestmentDealroom has a profile for this one. Try Dealroom →, KB SecuritiesDealroom has a profile for this one. Try Dealroom →, Cape Investment & SecuritiesDealroom has a profile for this one. Try Dealroom →, Pentastone InvestmentDealroom has a profile for this one. Try Dealroom →, Cheongdam Investment, Anda Asia VenturesDealroom has a profile for this one. Try Dealroom →, Heungkuk Securities, and Shinhan CapitalDealroom has a profile for this one. Try Dealroom → backed the round.
Why it stands out: The round lands in the 95th percentile of all-time seed rounds raised in South Korea, based on a sample of 3,081 deals.
What's the endgame? AnyCasting is targeting the global advanced packaging market with its own glass substrate metallisation technology. Semiconductor glass substrates need copper filled into microscopic through-glass vias to transmit signals, and the company has secured that plating process.
What sets it apart? AnyCasting uses an all-wet process based on electroless plating that eliminates the conventional titanium-copper sputtering step. It has also developed its own void-free criterion and is independently building dedicated plating equipment.
Where's the money going? AnyCasting is building a new pilot and mass-production facility for glass substrate and interposer plating at the Palgok Industrial Complex in Ansan, Gyeonggi Province. It is also roughly doubling its plating-equipment R&D space at its Seoul headquarters.
The signal: Glass substrates are seen as a next-generation platform for advanced semiconductor packaging, and AnyCasting's raise reflects investor appetite for the equipment and process technology underpinning that shift.
Read more: finance.biggo.com
Image credit: Generated with Gemini
