VeriMe raises $150M Series C for its 3D compute-in-memory AI chips
What's the deal? Chip startup VeriMeDealroom has a profile for this one. Try Dealroom → has raised 1 billion yuan (about $150 million) in a Series C round backed by a mix of financial and industry investors. Backers include Advantage CapitalDealroom has a profile for this one. Try Dealroom →, Yuanhao InvestmentDealroom has a profile for this one. Try Dealroom →, Jinpu InvestmentDealroom has a profile for this one. Try Dealroom →, Sunshine Life, Yuanhe PuhuaDealroom has a profile for this one. Try Dealroom →, Delian CapitalDealroom has a profile for this one. Try Dealroom →, Kuanqiao Hengsong, and Houxue CapitalDealroom has a profile for this one. Try Dealroom →, alongside strategic investors MEIG Smart Technology, Hengxu CapitalDealroom has a profile for this one. Try Dealroom →, and Huaqin Technology.
What's the endgame? VeriMe develops a three-dimensional compute-in-memory architecture it calls 3D-CIM. The company says the design breaks the "impossible triangle" of high performance, low power, and low cost that constrains AI chips.
What's it for? The chips target large-model inference across AI phones, AI PCs, IoT devices, all-in-one machines, servers, and robots. Several existing shareholders also added to their positions in this round.
Why now? Demand for inference silicon is climbing as generative AI moves from data centres to consumer and edge devices, where power and cost pressures are acute. That backdrop helps explain the strategic support from hardware makers such as Huaqin Technology and MEIG Smart Technology.
The signal: The round sits in the top tier of its class — roughly the 93rd percentile among 84 Series C deals in the sector and market. That places VeriMe among the better-funded bets on compute-in-memory as a path to cheaper, more efficient AI inference.
Read more: itjuzi.com
Image credit: Yu. Samoilov
