DayOne secures $237M debt facility for Hong Kong data centre
What's the deal? DayOne has secured a US$237 million syndicated term loan facility to finance a hyperscale data centre in Hong Kong. The debt was announced on 22 August 2026.
What it means. The financing will support construction, fit-out and commissioning of a campus designed for high-density artificial-intelligence workloads, cloud interconnects and enterprise computing. The facility will use liquid cooling, dedicated fibre routes to subsea cable landing stations and target a power usage effectiveness ratio below 1.25.
Why now? DayOne is deploying the capital ahead of a planned initial public offering on US equity exchanges, using debt to accelerate construction while managing its cost of capital.
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