Lips Semiconductor

Lips Semiconductor, formally Wuxi Leapers Semiconductor Co., Ltd., is a developer and manufacturer of power semiconductors, focusing on Silicon Carbide (SiC) and Insulated-Gate Bipolar Transistor (IGBT) modules. The company was established in 2019 and is headquartered in Wuxi, China, with a research and development center in Japan and production bases in both Wuxi and Kiryuu, Japan. It was jointly founded by Chinese and Japanese R&D experts, each possessing over 30 years of experience in the power semiconductor field. The company has secured a total of $36.2M in funding across several rounds, with investors including Guolian Investment, HyGoal Capital, New Alliance Capital, and SB China Venture Capital.

The firm's business model centers on the design, manufacturing, and sale of high-reliability SiC and IGBT modules for industrial and automotive applications. These products serve a diverse client base in sectors such as new energy vehicles (NEVs), smart grids, renewable energy (including solar and wind power), industrial motor drives, medical equipment, and uninterruptible power supplies. By providing comprehensive module application solutions, Leapers Semiconductor aims to facilitate the miniaturization, efficiency, and light-weighting of electric drive systems and inverters. In 2023, the company achieved multi-million dollar exports to Europe and North America.

Leapers Semiconductor's product portfolio includes SiC modules, SiC/Si hybrid modules, and IGBT modules. A key feature is the company's patented Arcbonding™ technology, introduced in 2021 as an alternative to traditional aluminum wire bonding. This technology is designed to enhance the reliability of SiC modules for automotive requirements by reducing parasitic resistance and inductance, which in turn lowers static losses and improves power cycling capabilities. The company also utilizes advanced packaging materials like silver sintering for die attach and Si3N4 AMB substrates for better thermal performance. In 2022, the company launched its automotive-grade HPD SiC power modules, a 1200V three-phase water-cooled system optimized for traction inverters. The company has expanded its offerings to include 1400V, 1700V, and 2200V SiC modules to meet increasing bus voltage demands in various applications.

Keywords: power semiconductors, SiC modules, IGBT modules, power electronics, Wuxi Leapers Semiconductor, automotive grade modules, new energy vehicles, smart grid solutions, renewable energy components, industrial motor drives, Arcbonding technology, silver sintering, Si3N4 AMB substrates, high power density, traction inverters, electric vehicle components, power module manufacturing, silicon carbide technology, energy storage systems, photovoltaic inverters, EV charging solutions, industrial power supplies, R&D Japan