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AscenPower / 芯粤能

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Guangzhou Nansha automotive-grade SiC power-chip IDM for EV, industrial, grid and PV applications

Guangzhou, ChinaFounded 2021Energy

Valuation $500M–1B Last recorded · 2024

Total funding $100–500M Disclosed equity funding

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About AscenPower / 芯粤能

AscenPower / 芯粤能 is a Guangzhou Nansha, China integrated device manufacturer focused on automotive-grade silicon-carbide power chips. Founded in 2021, it develops and manufactures SiC SBD/JBS and MOSFET wafers and related power solutions for electric-vehicle traction, industrial power supplies, renewable-energy, grid and photovoltaic applications. The company combines device research, engineering and manufacturing capabilities for wide-bandgap power conversion, and this profile should remain centered on the China SiC-device IDM rather than being merged with unrelated semiconductor companies or reduced to an epi-wafer-only business.

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At a glance

Status: Operational
Founded: 2021
Headquarters: Guangzhou, China
Open positions: None listed
Dealroom signal: 21.3/100
Industry: Energy, Semiconductors
Sector: Energy, Spinout, Semiconductor Designers and Manufacturers, Chips and Processors, Semiconductor Materials, Silicon Carbide (SiC), DT and LS, science-based
Technology: Hardware, Deep Tech
Business model: Manufacturing
Client focus: b2b
Links: Website

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Funding history

2 recorded events

Company financing events and reported valuations.

Deal type	Date	Amount	Valuation	Investors	Source
SERIES AOther financing	Sep 2024	$138M	$688M	Shenzhen Capital Group · Canton Venture Capital · Morningside Capital · SDIC Venture Capital	↗
SPINOUTOther financing	Jan 2021	$0	—	Hong Kong University of Science and Technology	—

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Growth signals

AscenPower / 芯粤能 website traffic

Latest recorded traffic for AscenPower / 芯粤能 is 3.2K monthly website visits, down 89% over the last three months.

Latest monthly visits3.2K 3-month web change-89%

Monthly website visitsSep 2024–May 2026

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