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Eliyan

Semiconductors · Santa Clara, United States · Founded 2021

Eliyan Corporation develops high-performance interconnect technology for chiplet-based systems, targeting the high-performance computing, artificial intelligence, and cloud computing markets. Founded in 2021 by CEO Ramin Farjadrad, Patrick Soheili, and Syrus Ziai, the Santa Clara-based company provides semiconductor IP and chiplet products that address the physical layer connectivity challenges in multi-die architectures. The founding team possesses extensive experience in the semiconductor industry, with Farjadrad having previously co-founded Aquantia and Velio Communications, and holding over 130 patents. Soheili has a background in corporate development and has been the CEO of three early-stage tech companies, while Ziai has held senior engineering roles at Nuvia, Qualcomm, and PsiQuantum. Eliyan's core offering is its NuLink™ PHY technology, a die-to-die (D2D) and chip-to-chip (C2C) interconnect solution. This technology is designed to deliver high bandwidth and power efficiency, enabling performance comparable to advanced packaging but on standard, less expensive organic substrates. A key feature is its patented simultaneous bidirectional (SBD) signaling, which doubles the bandwidth per interface by allowing data to be sent and received on the same wire concurrently. The company's technology is compatible with industry standards like Universal Chiplet Interconnect Express (UCIe) and Bunch of Wires (BoW). Eliyan's products include NuLink IP cores for D2D and C2C connections and NuGear™ chiplets for memory and I/O. The company also proposes a Universal Memory Interface (UMI) to allow a single ASIC design to connect to different memory types like HBM, GDDR, and DDR. Eliyan operates on an intellectual property (IP) licensing business model, providing its technology to chip makers for integration into their designs. The company serves clients in compute-intensive sectors such as data centers, cloud providers, and AI chip developers. By enabling the use of standard packaging, Eliyan helps customers reduce costs, simplify their supply chain, and improve system-level performance. The technology has been demonstrated on advanced manufacturing processes, including 3nm and 5nm nodes. To date, Eliyan has raised a total of $157 million in funding over several rounds, with significant investments from major industry players including Intel Capital, Samsung Catalyst Fund, SK hynix, Micron, Tiger Global Management, AMD, Arm, and Meta. Keywords: chiplet interconnect, die-to-die, NuLink, semiconductor IP, multi-die architecture, Universal Chiplet Interconnect Express, UCIe, Bunch of Wires, BoW, simultaneous bidirectional signaling, Universal Memory Interface, UMI, advanced packaging, organic substrate, Ramin Farjadrad, high-bandwidth memory, HBM, system-in-package, SiP, physical layer, PHY, AI accelerators, data centers, high-performance computing, fabless semiconductor, connectivity IP