CanSemi

The company's service offerings include the manufacturing of microprocessors, power management chips (PMICs), analog chips, and power discrete devices. CanSemi has developed differentiated technology platforms to address the demands for domestic chip manufacturing. Its product lines feature specialized items such as MOS, PMIC, mixed-signal (MS), CMOS Image Sensors (CIS), and Microcontroller Units (MCU). The core of its manufacturing capability lies in its 300mm wafer fabrication, with technology processes ranging from 0.18um down to 90nm in its initial phases, and plans to advance to 55-40nm and even 22nm nodes in subsequent expansions. The company has successfully obtained IATF 16949 certification, underscoring its commitment to the stringent quality standards required for automotive-grade products.

CanSemi's development has been marked by a multi-phase expansion plan, backed by substantial investment totaling over CNY 37 billion for its first three phases. The initial phases have been completed and are operational, with the construction of its third phase underway to significantly augment production capacity. Upon completion of all three phases, the company anticipates a total monthly capacity of 80,000 wafers, a considerable increase aimed at meeting the robust chip demand within the Guangdong-Hong Kong-Macao Greater Bay Area. The firm has attracted significant funding from a diverse group of investors, including GAC Capital, the Guangdong provincial government's semiconductor fund, SAIC Motor, and BAIC Group, highlighting strong support from both governmental bodies and major players in the automotive industry.