Aluksen Optoelectronics

Aluksen Optoelectronics, founded in 2016 and headquartered in Shenzhen, China, operates as a key supplier of high-speed optical interconnection chips. The company focuses on the design and manufacturing of high-speed electrical chips, silicon photonics chips, and opto-electronic integration products. Its business model is centered on providing these critical components to manufacturers and service providers within the telecommunications and data infrastructure sectors. Aluksen generates revenue through the sale of its semiconductor products, which include Drivers, Trans-Impedance Amplifiers (TIA), Clock and Data Recovery (CDR) units, and Passive Optical Network (PON) components.

The company's product portfolio is engineered to support various high-demand applications, including data centers, Fiber to the x (FTTx), 5G networks, and both metropolitan and long-haul backbone networks. Aluksen's chips are designed with Coherent, PAM4, and NRZ modulation technologies, enabling data rates from 25G up to 3.2T. This targets the needs of data center internal networks (DCN) and data center interconnections (DCI), as well as long-haul telecom core networks. For data centers, Aluksen provides solutions like Active Optical Cables (AOC) to facilitate high-bandwidth connections between racks and for storage and high-performance computing.

Since its inception, Aluksen has reached several significant milestones. In 2017, it was recognized by Goldman Sachs as a notable 5G chip company in China. The firm achieved ISO9001 certification in 2018 and began delivering 100G coherent electrical chips, becoming a key local supplier for operator core networks. The company secured Series A financing in 2019, followed by a Series A+ round in 2021, the same year it onboarded a silicon photonics team to develop integrated products. By 2022, Aluksen had completed its Series B financing, delivered a 112GBaud Driver and TIA for 1.6T applications, and supplied 400G coherent electrical chips to operator networks. In 2024, the company announced it had shipped millions of chips for data center applications.

Keywords: optical interconnection chips, high-speed electrical chips, silicon photonics, opto-electronic integration, data center solutions, 5G network components, FTTx, backbone network, telecom semiconductors, PAM4 modulation, Coherent technology, Trans-Impedance Amplifiers, CDR, PON, optical communication, DCI, semiconductor design, analog circuits, mixed-signal IC