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Zibo Core Material Integrated Circuit

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High-precision IC substrate boards for advanced packaging.

ChinaFounded 2021Semiconductors
Valuation $250–500M Last recorded · 2026
Total funding $50–100M Disclosed equity funding
Unlock exact values This page shows ranges. Dealroom has the exact numbers for Zibo Core Material Integrated Circuit and the history behind them.

About Zibo Core Material Integrated Circuit

Zibo Core Material Integrated Circuit (also known as Zibo Xincai Integrated Circuit or XinCaiIC) is a company focused on the research, development, manufacturing, and sales of high-precision, high-order substrate boards for the advanced integrated circuit (IC) packaging sector. The company was established in September 2021 in Zibo, Shandong, and is led by Chairman Zhu Guoqi.

XinCaiIC's core business revolves around producing crucial components for the semiconductor industry, specifically IC substrate boards which are key materials for advanced packaging. The company's product portfolio includes Flip Chip-Chip Scale Package (FC-CSP), Flip Chip-Ball Grid Array (FC-BGA), and System-in-Package (SiP) substrates. These products are critical for applications in high-growth markets such as 5G communications, AI chips, automotive electronics, PCs, servers, and consumer electronics. The firm's technical expertise is centered on processes like mSAP (modified semi-additive process), ETS (embedded trace substrate), and SAP (semi-additive process). The core technical team possesses an average of over 15 years of experience from leading companies in the industry.

A significant milestone for the company was the launch of its "Integrated Circuit Packaging Substrate Project" in Zibo High-tech Zone in 2022, with a total investment of 3.5 billion yuan. The project aims to produce two million IC packaging substrate boards annually, positioning the company to provide a domestic alternative to imported high-end precision substrates. By the end of 2023, the first phase of the plant construction and equipment debugging was completed. The company planned for mass production of FC-CSP substrates and sample production of FC-BGA substrates in 2024. XinCaiIC has successfully raised significant capital, including a Series A+ financing round of several hundred million yuan in early 2024 from investors such as Qianhai FOF, Longding Investment, and Lightspeed China Partners, with the funds allocated for production line construction.

Source: Dealroom company data

At a glance

Status
Operational
Founded
2021
Headquarters
China
Open positions
None listed
Dealroom signal
21.3/100
Industry
Semiconductors
Sector
Semiconductors, Core AI, Semiconductor Engineering Tools, DT and LS, science-based
Technology
Artificial Intelligence, Hardware, Deep Tech
Business model
Manufacturing
Client focus
b2b
Links
Website

Funding history

3 recorded events

Company financing events and reported valuations.

Deal typeDateAmountValuationInvestorsSource
SERIES COther financing Feb 2026 $28M $261M Henghui Electronics Technology ↗
SERIES BOther financing Nov 2024 $28M $138M Addor Capital · Delta Capital · Jinbang Capital · Northern Lights Venture Capital ↗
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Growth signals

Zibo Core Material Integrated Circuit website traffic

Latest recorded traffic for Zibo Core Material Integrated Circuit is 220 monthly website visits, down 80% over the last three months.

Latest monthly visits220 3-month web change-80%
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Investments and acquisitions

Capital deployed

Recent portfolio relationships for companies that also act as investors or acquirers.

Investors

13 investors on the cap table

From Dealroom's funding and investor records, grouped by the round each investor first entered.

Series A12 investors entered at this stage

  • Addor Capital
  • Delta Capital
  • Qianhai FOF
  • National Small and Medium Enterprise Development
  • Beijing Guoke Xinghe Investment Management
  • Long Ding Capital
  • Fengyuan Capital
  • NLVC
  • Shandong New Growth Drivers Fund
  • Cowin Capital
  • Jinbang Capital
  • Northern Lights Venture Capital

Series B and later1 investor entered at this stage

  • Henghui Electronics Technology
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Potential founders Hidden — book a demo likely future founders
Startup mafia Hidden — book a demo alumni-founded startups
Talent movements Hidden — book a demo in · Hidden — book a demo out past 12 months

Source: Dealroom Talent Intelligence.

Global footprint

Workforce and web traffic by country
Workforce by country
🇨🇳 China HQ
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Market sentiment

Posts on X, past 7 days

An AI-synthesised read of the highest-engagement posts about Zibo Core Material Integrated Circuit on X, ranked by likes and reposts, corporate channels excluded.

Reading the room on X — pulling top posts and synthesizing themes…

Source: X recent search ranked by engagement (likes + retweets) · Synthesis by Claude · Cached for 1 hour

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