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Zibo Core Material Integrated Circuit
High-precision IC substrate boards for advanced packaging.
About Zibo Core Material Integrated Circuit
Zibo Core Material Integrated Circuit (also known as Zibo Xincai Integrated Circuit or XinCaiIC) is a company focused on the research, development, manufacturing, and sales of high-precision, high-order substrate boards for the advanced integrated circuit (IC) packaging sector. The company was established in September 2021 in Zibo, Shandong, and is led by Chairman Zhu Guoqi.
XinCaiIC's core business revolves around producing crucial components for the semiconductor industry, specifically IC substrate boards which are key materials for advanced packaging. The company's product portfolio includes Flip Chip-Chip Scale Package (FC-CSP), Flip Chip-Ball Grid Array (FC-BGA), and System-in-Package (SiP) substrates. These products are critical for applications in high-growth markets such as 5G communications, AI chips, automotive electronics, PCs, servers, and consumer electronics. The firm's technical expertise is centered on processes like mSAP (modified semi-additive process), ETS (embedded trace substrate), and SAP (semi-additive process). The core technical team possesses an average of over 15 years of experience from leading companies in the industry.
A significant milestone for the company was the launch of its "Integrated Circuit Packaging Substrate Project" in Zibo High-tech Zone in 2022, with a total investment of 3.5 billion yuan. The project aims to produce two million IC packaging substrate boards annually, positioning the company to provide a domestic alternative to imported high-end precision substrates. By the end of 2023, the first phase of the plant construction and equipment debugging was completed. The company planned for mass production of FC-CSP substrates and sample production of FC-BGA substrates in 2024. XinCaiIC has successfully raised significant capital, including a Series A+ financing round of several hundred million yuan in early 2024 from investors such as Qianhai FOF, Longding Investment, and Lightspeed China Partners, with the funds allocated for production line construction.
Source: Dealroom company dataAt a glance
- Status
- Operational
- Founded
- 2021
- Headquarters
- China
- Open positions
- None listed
- Dealroom signal
- 21.3/100
- Industry
- Semiconductors
- Sector
- Semiconductors, Core AI, Semiconductor Engineering Tools, DT and LS, science-based
- Technology
- Artificial Intelligence, Hardware, Deep Tech
- Business model
- Manufacturing
- Client focus
- b2b
- Links
- Website
Knowledge graph
More headlines
Funding history
Company financing events and reported valuations.
| Deal type | Date | Amount | Valuation | Investors | Source |
|---|---|---|---|---|---|
| SERIES COther financing | Feb 2026 | $28M | $261M | Henghui Electronics Technology | ↗ |
| SERIES BOther financing | Nov 2024 | $28M | $138M | Addor Capital · Delta Capital · Jinbang Capital · Northern Lights Venture Capital | ↗ |
Growth signals
Latest recorded traffic for Zibo Core Material Integrated Circuit is 220 monthly website visits, down 80% over the last three months.
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Investments and acquisitions
Recent portfolio relationships for companies that also act as investors or acquirers.
Investors
From Dealroom's funding and investor records, grouped by the round each investor first entered.
Series A12 investors entered at this stage
Addor Capital
- DCDelta Capital
Qianhai FOF
National Small and Medium Enterprise Development
Beijing Guoke Xinghe Investment Management- LCLong Ding Capital
Fengyuan Capital
NLVC
Shandong New Growth Drivers Fund
Cowin Capital
Jinbang Capital- NCNorthern Lights Venture Capital
Series B and later1 investor entered at this stage
- HTHenghui Electronics Technology
Source: Dealroom Talent Intelligence.
Global footprint
Market sentiment
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Source: X recent search ranked by engagement (likes + retweets) · Synthesis by Claude · Cached for 1 hour
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