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Systech Semi / 芯栋微
Wafer-level ECD/ECP electroplating and wet-process equipment (Songjiang, Shanghai)
About Systech Semi / 芯栋微
Systech Semi (芯栋微（上海）半导体技术有限公司; formerly Xinyang Silicon Micro / 新阳硅密) develops semiconductor wet-process ECD/ECP electroplating tools and related wet equipment for wafer-level interconnect and advanced packaging. Based in Songjiang, Shanghai, it supplies Cu/Ni/Au/SnAg plating platforms for R&D through production and is partly owned by listed materials group Shanghai Sinyang.
Source: Dealroom company dataAt a glance
- Founded
- 1999
- Headquarters
- Songjiang District, China
- Sector
- Semiconductors
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Investors
From Dealroom's funding and investor records, grouped by the round each investor first entered.
Seed2 investors entered at this stage
Peak Ventures
Infini Capital
Series A3 investors entered at this stage
- CFChina World Trade Industry Fund
- GIGuoxin Investment
- SGShanghai STVC Group
Source: Dealroom Talent Intelligence.
Global footprint
Market sentiment
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Source: X recent search ranked by engagement (likes + retweets) · Synthesis by Claude · Cached for 1 hour
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