Xingyun Integrated Circuit

About Xingyun Integrated Circuit

Xingyun Integrated Circuit (Xingyun IC) is a semiconductor startup developing high-performance Graphics Processing Unit (GPU) chips specifically for large model artificial intelligence (AI) inference applications. The company was founded in August 2023 by CEO Dr. Ji Yu and CTO Dr. Yu Hongmin. Dr. Ji, a graduate of Tsinghua University with a PhD in computer architecture, was part of Huawei's "Genius Youth" program where he contributed to the development of the Ascend AI chips. Dr. Yu is a semiconductor development expert with over a decade of experience leading chip design and production at major technology firms including Baidu, Huawei, and Horizon Robotics. Xingyun IC's strategy is to create a foundation for the AI industry analogous to the white-box hardware model that revolutionized the PC and internet industries. The company aims to develop specialized GPUs that can be integrated into general x86 servers, creating a low-cost, high-performance product designed to handle the memory-intensive requirements of large AI models. This approach, centered on heterogeneous computing and "white-box" assembled systems, seeks to significantly reduce the cost and enhance the quality of AI model computing systems. The company's primary focus is on the research and development of these next-generation GPUs to provide clients with more efficient and affordable products. The company has successfully secured substantial funding to support its growth and development plans. It raised billions of yuan in angel and angel+ financing rounds from investors including Zhipu AI, Ren'ai Group, Casstar, Miracle Plus, and ShuiMu Tsinghua Alumni Capital. In April 2026, the company secured an additional RMB 400 million ($57.1 million) in a Pre-A funding round led by 5Y Capital, Primavera, and SAIF Investment Fund. Xingyun IC plans to achieve mass production of its AI assembler products by 2026. Keywords: GPU chips, large model inference, AI hardware, semiconductor, heterogeneous computing, white-box hardware, AI accelerators, data center chips, Ji Yu, Yu Hongmin, integrated circuits, high-performance computing, AI chip startup, Ascend chips, x86 servers, chip design