Tsingtech Microvision

About Tsingtech Microvision

Beijing Tsingtech Microvision Technology Co., Ltd. operates as a fabless semiconductor company focused on the design and application of reconfigurable computing chips. The company was established in July 2018, commercializing nearly two decades of research from Tsinghua University's Microelectronics Institute. The founding team includes CEO Wang Bo, who previously served as a CTO for a publicly-listed AI company, and Chief Scientist Yin Shouyi, a professor at Tsinghua University's Department of Microelectronics who has been instrumental in the underlying technology's development since 2007. The name 'Tsingtech Microvision' (Qingwei) itself is a nod to Tsinghua University and its Microelectronics department, signifying its origins.

Tsingtech Microvision develops and sells intelligent computing chips based on a coarse-grained reconfigurable architecture (CGRA), which it refers to as Reconfigurable Processing Units (RPU). This architecture allows the chip's hardware resources to be dynamically reconfigured in real-time to create an optimal computational path for specific AI tasks, positioning it as a flexible and efficient alternative to GPUs and ASICs. The company's business model involves providing these chip products and comprehensive solutions to a range of clients. Revenue is generated from the sale of its chips and accelerator cards, which are deployed across cloud, edge, and terminal applications. By December 2025, the company had shipped over 30 million reconfigurable chips and secured orders for 20,000 computing cards.

The company's product portfolio is structured around its core CGRA technology and includes the TX series of chips. The TX5 series is designed for high-efficiency edge and terminal applications such as smart security, intelligent office, and smart wearables. The TX8 series targets high-performance cloud computing, particularly for AI training and inference in large-scale intelligent computing centers. A key product is the TX81 chip, which is designed to deliver high performance without relying on advanced manufacturing processes. This is complemented by the proprietary TSM-LINK interconnect technology, which enables high-bandwidth, low-latency direct connections between chips, reducing reliance on external switches and lowering overall solution costs by up to 50% compared to industry alternatives. The company serves clients like Alibaba, State Grid, and China Mobile, and has established its hardware in over ten large-scale intelligent computing centers across China.