Tianjin Xunlin Technology

About Tianjin Xunlin Technology

Advanced manufacturing company focused on surface metallization of ceramic and glass electronic substrates, using proprietary PVD (physical vapor deposition) processes to enable copper coating routes for next-generation packaging and module applications. Its offerings are positioned as an alternative pathway to conventional copper-clad or plated substrate approaches, targeting bottlenecks in performance and cost for use cases such as semiconductor advanced processes, high-definition display modules, and power devices (including demanding thermal and reliability environments). The company’s product scope, as presented publicly, includes copper-coated glass substrates and ceramic substrate solutions associated with common industry process families (e.g., DPC, DBC/AMB). Public materials also indicate manufacturing presence in Tianjin and Qingdao and progression from process validation toward production and early batch orders. In 2025, the company reported completing a pre–Series A financing round to support R&D, commercialization, and industrial capacity build-out, and Chinese corporate registry data lists the entity as operating. Keywords: PVD, metallization, copper coating, glass substrate, ceramic substrate, DPC, DBC, AMB, semiconductor packaging, display modules, power electronics