SyChip
And markets radio frequency integrated circuits and chip scale modules for the wireless internet appliance market
About SyChip
SyChip, Inc. operated as a designer and marketer of Radio Frequency Integrated Circuits (RFIC) and Chip Scale Modules (CSM) tailored for the wireless internet appliance market. The company was established on October 1, 1999, originating as a spin-out from Lucent Technologies Inc.'s New Ventures Group. Key figures in its inception include Dennis Peasenell, who served as the initial President and CEO, and King Tai, a Bell Labs fellow who became the Chief Technical Officer and developed the core packaging technologies. A Shanghai-based subsidiary was founded in 2000 by Moses Asom.
The firm concentrated on developing highly integrated RF modules, leveraging proprietary integration methods, modular architectures, and low-loss silicon technologies. This approach aimed to make RF designs more predictable and easier to simulate, which in turn was expected to shorten time-to-market for their clients' products while boosting performance and reliability. SyChip’s product strategy involved offering integrated RF devices in flip-chip packages that combined memory, analog, and digital functions. These modules were designed to be compliant with prevailing wireless standards such as GPS, 3G, GPRS, and Bluetooth, targeting manufacturers of cellular phones, personal digital assistants (PDAs), and laptop computers.
Initial funding came from Lucent and APack Technologies Inc., a Taiwanese packaging and foundry company that also served as an early production partner. SyChip was a venture-backed company, attracting investments from firms like Austin Ventures, 3i Group, and Sierra Ventures. The company's business model revolved around providing these advanced wireless modules to a broad set of customers needing to integrate wireless functionalities into their electronic devices. On April 17, 2006, SyChip was acquired by Murata Manufacturing Co., Ltd., a major supplier of passive electronic components, for approximately $140 million. The acquisition was intended to combine Murata's resources and global sales force with SyChip's design expertise and entrepreneurial approach to serve a wider customer base seeking integrated wireless modules for functionalities like GPS, WiFi, WiMAX, and mobile TV. All SyChip employees were expected to join Murata following the acquisition.
Source: Dealroom company dataAt a glance
- Status
- Acquired
- Founded
- 1999
- Headquarters
- Plano, United States
- Employees
- 16
- Open positions
- None listed
- Dealroom signal
- 55.1/100
- Industry
- Home Living, Semiconductors
- Sector
- Semiconductors, Appliances, Chips, Spinout, Semiconductor Designers and Manufacturers, Chips and Processors, DT and LS, science-based
- Technology
- Deep Tech
- Business model
- Manufacturing
- Client focus
- b2c
Knowledge graph
More headlines
Funding history
Company financing events and reported valuations.
| Deal type | Date | Amount | Valuation | Investors | Source |
|---|---|---|---|---|---|
| ACQUISITIONOther financing | Apr 2006 | $0 | — | Undisclosed | — |
| SERIES DOther financing | Jun 2004 | $20M | $80M | Silicon Valley Bank · 3i Group · Alliance Technology Ventures · IGNITE GROUP LTD | — |
Growth signals
Latest recorded traffic for SyChip is 0 monthly website visits. SyChip's team grew 0% over the past year.
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Investments and acquisitions
Recent portfolio relationships for companies that also act as investors or acquirers.
Investors
From Dealroom's funding and investor records, grouped by the round each investor first entered.
Series A8 investors entered at this stage
3i Group- AVAlliance Technology Ventures
Lucent- PGPacesetter Capital Group
New Venture Partners
Genesis Park
Masthead Venture Partners- MPMarkpoint Venture Partners
Series B and later5 investors entered at this stage
Sierra Ventures
K2
Austin Ventures
Silicon Valley Bank- ILIGNITE GROUP LTD
Other known investors1 additional known investor
Nokia Bell Labs
Source: Dealroom Talent Intelligence.
Global footprint
team presence
Market sentiment
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