Sky Semiconductor

About Sky Semiconductor

Established in July 2018, Xiamen Sky Semiconductor Technology Co., Ltd. is a specialized firm in the semiconductor sector, concentrating on advanced packaging and system integration for high-speed, high-frequency communication applications. The company was founded by Dr. Daquan Yu, who also serves as the company's Chairman. Dr. Yu is a distinguished figure in China's integrated circuit packaging industry, having previously served as CTO for the publicly-listed company Tianshui Huatian Technology and has been recognized with the National Science and Technology Progress Award. He founded Sky Semiconductor to transition research achievements into industrial applications, choosing Xiamen to simultaneously pursue his entrepreneurial and academic goals as a distinguished professor at Xiamen University.

Sky Semiconductor operates as a foundry, providing a comprehensive suite of services from collaborative product design and process development to mass production for a client base that includes design firms, component companies, and research institutes. The company's business model is centered on offering advanced packaging-as-a-service, addressing the growing demand for smaller, more efficient electronic components. Its revenue is generated through these foundry services. The company has secured significant funding to support its expansion, including an Angel round in October 2018 from Xiamen Semiconductor Investment Group, a Series A of over 100 million RMB in October 2020, and a Series B of several hundred million RMB in December 2021.

The company's core technological offerings are centered around advanced wafer-level packaging solutions. Key services include wafer-level 3D packaging (WLP), Fan-Out (FO) packaging, System-in-Package (SiP), and Integrated Passive Devices (IPD) manufacturing. A cornerstone of its technical capabilities is the Through-Glass Via (TGV) technology, which enables high-density vertical interconnections through glass substrates, offering superior electrical performance and miniaturization compared to traditional methods. This technology is particularly crucial for 5G RF modules, millimeter-wave chip integration, and biomedical devices. Sky Semiconductor has developed capabilities for 4, 6, 8, and 12-inch wafers, positioning itself to serve a wide range of applications in the telecommunications, automotive, and medical fields.