Chengdu Silan Semiconductor Manufacturing

About Chengdu Silan Semiconductor Manufacturing

Chengdu Silan Semiconductor Manufacturing Co., Ltd., established in November 2010, operates as a key semiconductor manufacturing base in Western China for its parent company, Hangzhou Silan Microelectronics Co., Ltd. Located in the Chengdu-Aba Industrial Concentrated Development Zone, the company was founded as part of Hangzhou Silan Microelectronics' strategic expansion. Hangzhou Silan Microelectronics itself was co-founded in 1997 by seven individuals, including Chen Xiangdong and Fan Weihong, who left the state-owned enterprise Huayue Microelectronics to build a new venture. Chen Xiangdong, a Fudan University graduate, and Fan Weihong, a Zhejiang University graduate, brought extensive experience from their previous roles, which was instrumental in establishing one of China's first private integrated device manufacturer (IDM) companies.

Chengdu Silan specializes in the production of semiconductor silicon epitaxial wafers, boasting the capability to manufacture 5-inch, 6-inch, 8-inch, and 12-inch wafers. Its business model is deeply integrated with its parent company, functioning as a crucial manufacturing and packaging center. This integrated device manufacturing (IDM) approach allows the company to cover the entire process from chip design to manufacturing and packaging. The company's revenue stream is derived from the sale of its manufactured semiconductor products to a wide array of clients. The firm focuses on developing and producing power devices, power modules, high-voltage integrated circuits, and LED chips.

The company's product portfolio is extensive, covering power devices, IGBTs, IPM intelligent modules, HVDMOS, SBD, and FRD, which are utilized in various sectors including communications, home appliances, industrial applications, photovoltaics, and new energy vehicles. A notable achievement is its global leadership in the white goods IPM (Intelligent Power Module) market. The facility is also a critical center for power semiconductor product packaging and testing, with its advanced packaging technology reaching international standards. Significant investments have been made to expand its operations, including funding for its automotive IC packaging business and the construction of a new semiconductor packaging plant for automotive power modules. The silicon epitaxy workshop began trial production in 2014, marking a significant milestone in its operational history.