Shanghai Lixin Software Technology

Shanghai Lixin Software Technology Co., Ltd., also known as Leda Technology, is a software technology developer established in 2020 and headquartered in Shanghai, China. The company specializes in creating Electronic Design Automation (EDA) tools for integrated circuits, focusing on digital circuit design, physical verification, and 3DIC/chiplet system design. Its stated mission is to build a reliable set of tools for digital design and support the development of China's independent chip research and development ecosystem.

The founder and chairman of the company, Jianli Chen, is a professor at the School of Microelectronics at Fudan University. The core management team possesses an average of over 20 years of experience in the EDA tools sector, covering theoretical research, technical development, and commercial operations. Leda Technology's team is composed of industry experts, scientists, and talent from prominent universities such as Tsinghua, Peking, Fudan, UIUC, and UCLA, with over two-thirds holding master's or doctoral degrees.

Leda Technology's business model is centered on the development and sale of its proprietary EDA software suites. These products cater to clients in the semiconductor and integrated circuit design industry. The company has launched several platforms, including the LeCompiler digital implementation platform, the LePI power integrity platform, the LePV physical verification platform, and the Le3DIC 3D-IC design platform, which have been commercially adopted. Specific tools within these platforms include LeSyn for logic synthesis, LePlan for layout planning, and LeAPR for placement and routing. These tools are designed to provide intuitive data flow analysis and help designers achieve better performance metrics.

The company has secured significant funding to support its growth and product development. It completed a Series A round of $26.6M on October 21, 2021, with investors like Sharelink Capital and Bowei Investment. This was followed by a Series B round on September 19, 2024, raising over CNY 200 million (approximately $28.2M), led by SDIC Venture Capital Management and Shenzhen Capital Group. In March 2021, Hubble Technology Investment Co., Ltd., a company related to Huawei, acquired a 20% stake. Leda Technology operates R&D centers in Shanghai, Beijing, Fuzhou, and Changsha and has a team of nearly 300 people. Keywords: EDA tools, integrated circuit design, electronic design automation, semiconductor software, chip design, physical verification, logic synthesis, 3DIC design, chiplet system design, digital circuit design, layout and routing, power integrity analysis, Jianli Chen, Fudan University, LeCompiler, LePI, LePV, Le3DIC, placement and routing technology, RTL-to-GDSII, VLSI layout