Ruijiewei

About Ruijiewei

Suzhou Ruijiewei Technology Group Co., Ltd. (RMT) operates as a comprehensive service provider for high-end integrated circuit packaging and testing. Established in 2016 and headquartered in Suzhou, China, the company has positioned itself as a key player in the domestic semiconductor industry. The Chairman of Ruijiewei Technology Group is Mr. Fang Jia'en. The company has secured multiple rounds of funding, including a B+ round in January 2025 and a previous B round that raised nearly 300 million yuan, indicating strong investor confidence in its growth trajectory.

RMT offers a full-process manufacturing and testing solution for Chiplet and high-end chips. Its services encompass package design and simulation, large-scale processing and manufacturing, and finished product testing. The company serves a diverse client base, including over 300 research institutes and high-end commercial customers, delivering solutions for commercial, industrial, and automotive-grade chips. The business model revolves around providing one-stop solutions for advanced packaging, from initial design to mass production. Key services include 2.5D System in Package (SiP), Flip Chip Ball Grid Array (FCBGA), Wire Bond Ball Grid Array (WBBGA), and Quad Flat No-lead Package (QFN).

A significant aspect of RMT's strategy is its focus on Chiplet technology, a next-generation packaging approach. The company is a key participant in the development of China's chiplet technical standards and has established a pilot platform for the entire 2.5D domestic packaging design and process flow. RMT's mission is to facilitate the domestic packaging and testing of high-end core chips made in China. Its operational layout is extensive, with a headquarters and R&D center in Suzhou, a testing and engineering center in Zhengzhou, a marketing and sales center in Shanghai, and additional offices in Beijing and Changsha.