Rong Semiconductor

The company's core business is centered on 12-inch wafer manufacturing and wafer-level packaging and testing. Rong Semiconductor serves chip design companies by producing a range of analog and mixed-signal integrated circuits. Its product portfolio includes CIS (image sensor chips), TDDI (touch and display driver integration), BCD (power management ICs), display driver chips, and new storage solutions. These components are utilized across various downstream markets, including industrial control, consumer electronics, mobile communications, and automotive electronics. The company has developed multiple technology platforms and engages with domestic chip design firms through a 'virtual IDM' model, which involves deep capital and business integration.

Rong Semiconductor has expanded its manufacturing footprint with production lines in both Ningbo and Huai'an. The Huai'an project began in 2021 with the acquisition of assets from the former Dehuai Semiconductor. The first products from this line were mass-produced in 2022. In April 2025, the company commenced construction of a new 16 billion yuan 12-inch integrated circuit production line in Ningbo, which is expected to have a monthly capacity of 35,000 wafers. The company's long-term goal is to achieve a monthly production capacity of 200,000 12-inch wafers by 2030. Rong Semiconductor has been recognized as a 'unicorn' company, appearing on the 2024 Global Unicorn List by the Hurun Research Institute. Wu Shengwu serves as the company's Chairman and co-CEO.