Replisaurus

The company targeted its ECPR process at manufacturers of microelectronic devices, MEMS, and advanced substrates. A key component of their business model involved the development and fabrication of reusable master electrodes, which act as templates to create metal patterns in a single replication step. To support this, Replisaurus established a subsidiary named Replisaurus Mastering. A significant milestone occurred in 2006 when the company secured $14.4 million in first-round funding led by Wellington Partners and Northzone Ventures, which also saw the appointment of industry veteran James Quinn as CEO. Another major development was the 2008 acquisition of S.E.T. SAS, a supplier of high-accuracy device bonders, to strengthen its position in the advanced packaging market. This acquisition integrated S.E.T.'s expertise in die-to-die and die-to-wafer bonding tools.

Under the leadership of James Quinn as CEO, Patrik Möller as CTO, and Mikael Fredenberg as COO, the company focused on commercializing its technology. A key strategic move was a multi-year partnership with CEA-Leti, a French research center, to utilize its advanced manufacturing facilities for 200mm and 300mm wafer technologies. This collaboration aimed to optimize the ECPR process and explore new applications. Keywords: ElectroChemical Pattern Replication, ECPR, metallization technology, semiconductor manufacturing, microelectronics, advanced packaging, 3D integration, TSV, copper pillars, integrated passives, MEMS, wafer technologies, metal printing, device bonders, die-to-wafer bonding, semiconductor process, Patrik Möller, Mikael Fredenberg, James Quinn, S.E.T. SAS, CEA-Leti