Qili Semiconductor

About Qili Semiconductor

Qili Semiconductor (Shaoxing) Co., Ltd., also known as HChiplet, is a technology company established in 2023 specializing in the advanced packaging of semiconductors. Headquartered in Shaoxing, China, the firm operates as an advanced packaging supplier with a primary focus on Chiplet technology, which involves partitioning a large system-on-a-chip (SoC) into smaller, interconnected chiplets. This approach allows clients to achieve greater design flexibility, improved computing efficiency, and more cost-effective scaling. The company's business model is centered on providing a comprehensive, one-stop service for semiconductor manufacturers and system integrators. This includes packaging design, IC substrate design, electromagnetic simulation, and contract manufacturing services. Qili Semiconductor's main offerings consist of advanced packaging for high-performance computing (HPC) chips such as GPUs, CPUs, NPUs, and DPUs. Its technology portfolio includes 2.5D/3D integration, Flip Chip Packaging, Wafer Level Packaging, and System-in-Package (SiP). The target markets are demanding sectors like artificial intelligence, automotive electronics, big data storage and computing, and signal communication. The founding team is composed of industry veterans with over two decades of experience in factory operations and management from prominent semiconductor firms like ASE, STMicroelectronics, and Tongfu Microelectronics. The company's stated mission is to overcome technological gaps in China's domestic advanced packaging sector, particularly concerning data integrity and process maturity, thereby reducing reliance on overseas technology. In May 2024, Qili Semiconductor secured early-stage venture capital funding from investors including Cloud Capital (China) and Xiamen State-owned Capital Operation, indicating market confidence in its strategy and capabilities. Keywords: Chiplet, advanced packaging, 2.5D integration, 3D-IC, heterogeneous integration, system-in-package, SiP, outsourced semiconductor assembly and test, OSAT, HPC packaging, AI chip packaging, GPU packaging, CPU packaging, semiconductor manufacturing, IC substrate design, packaging simulation, flip chip, wafer level packaging, fan-out packaging, fcBGA, semiconductor China, Shaoxing, high-performance computing