Phix Systems

PHIX is a foundry specializing in the assembly and packaging of Photonic Integrated Circuits (PICs) and Micro-Electromechanical Systems (MEMS). Founded in 2018 by Albert Hasper (CEO) and Joost van Kerkhof (COO), the company serves as a critical link between the design and volume production of PIC-enabled modules. Both founders bring extensive experience from the high-tech and micro-nano technology industries, having held leadership roles at companies like LioniX International, Texas Instruments, and Sensata Technologies. PHIX is strategically located in Enschede, the Netherlands, a hub for photonics research and development.

The company operates as an Outsourced Semiconductor Assembly and Test (OSAT) partner for the photonics industry, providing a one-stop-shop for customers from the initial design phase to scalable volume manufacturing. Its business model is based on providing contract manufacturing and assembly services, helping clients who want to outsource their production processes or require a secondary supplier. This approach allows customers to move from prototype quantities to high-volume production. The service portfolio includes chip-to-chip hybrid integration, coupling PICs to fiber arrays, and managing DC and RF electrical signal interfacing. PHIX possesses expertise in handling all major PIC technology platforms, including Indium Phosphide (InP), Silicon Photonics (SiPh), and Silicon Nitride (SiN).

PHIX serves a global customer base across several high-growth markets. Key sectors include telecommunications for applications like 5G, automotive for LiDAR systems, medical devices for diagnostics, and quantum computing. By packaging PICs—which are not functional on their own—into robust optoelectronic modules, PHIX enables the commercialization of advanced photonic technologies in these fields. In 2024, the company announced a move to a new, larger facility to accommodate customer growth and further industrialize its production capabilities.

Keywords: Photonic Integrated Circuits, PIC packaging, PIC assembly, optoelectronics, OSAT, micro-assembly, MEMS assembly, hybrid integration, fiber array coupling, Indium Phosphide, Silicon Photonics, Silicon Nitride, Planar Lightwave Circuit, LiDAR, quantum computing, datacom, telecom, medical devices, contract manufacturing, Albert Hasper, Joost van Kerkhof, high-volume manufacturing