NexRay

About NexRay

NexRay is an emerging X-ray inspection equipment line developed by the South Korean semiconductor technology firm, Nextin. Headquartered in Hwaseong-si, Nextin was established in July 2010 by CEO Tae Hoon Park and has become a notable player in the semiconductor inspection market, going public on the KOSDAQ in October 2020. The company built its reputation on optical wafer inspection systems, such as AEGIS and IRIS, which utilize dark-field and bright-field technologies to detect microscopic defects on semiconductor wafers.

Leveraging its expertise in defect detection, Nextin has expanded its portfolio to address the next generation of semiconductor manufacturing with the introduction of NeXray. This new equipment is specifically designed for the advanced packaging market, which is critical for high-performance computing and AI applications. NeXray's primary function is to provide inspection for hybrid bonding, a cutting-edge technique that connects chiplets or wafers vertically without using traditional solder bumps. This method allows for denser, faster, and more power-efficient chip packages. As the industry moves toward these complex 3D structures, the ability to see inside the package to find voids, misalignments, or cracks becomes essential, a task for which X-ray technology is uniquely suited.

Nextin's business model is centered on developing and selling high-tech inspection and metrology equipment to global semiconductor manufacturers. Its clients include major industry names like Samsung, SK Hynix, and Intel. The introduction of NeXray positions the company to capitalize on the technological shift toward heterogeneous integration and 3D packaging. While its established products like KROKY and IRIS focus on surface and 3D optical inspection, NeXray provides a solution for non-destructive internal inspection, addressing a crucial quality assurance gap in the most advanced semiconductor assembly processes.