Jingtong Technology

About Jingtong Technology

Hangzhou Jingtong Technology Co., Ltd., operating as Jingtong Technology, is a specialized provider of advanced semiconductor packaging solutions, established in 2018. The company was founded by CEO Jiang Zhenlei, who brings extensive experience in chip design and packaging enterprise management from his previous roles as the founder of Wuxi Naxun Microelectronics and co-founder of Wuxi Baoling Electronic Technology. Jingtong Technology addresses the increasing demand for high-performance, miniaturized, and cost-effective chip integration, driven by the slowdown of Moore's Law and the rise of high-compute applications. The company has positioned itself as a key domestic player in a market segment historically dominated by international giants like TSMC and Samsung.

The core of Jingtong's business is providing a one-stop service that encompasses design, simulation, and testing for advanced chip packaging. It focuses on two primary technology platforms: Fan-out Wafer-Level Packaging (FOWLP) and Chiplet integration. The company has developed its own proprietary Fan-out System-in-Package (FOSiP) technology, which enables the integration of multiple chips in a 3D stacked configuration. A key offering is its embedded silicon bridge technology, 'MST Fobic,' which facilitates ultra-high-density connections between chiplets at a sub-micron level, offering a more cost-effective and thinner alternative to traditional 2.5D solutions. This technology is crucial for producing System-on-a-Chip (SoC) processors, GPUs, and AI accelerators for sectors including high-performance computing, mobile devices, autonomous driving, and IoT.

Jingtong Technology operates on a business-to-business model, serving as a solution provider for chip design companies and manufacturers of electronic devices. Revenue is generated by providing comprehensive packaging and testing services. The company has established a significant manufacturing presence with its first production line in Yangzhou, which became operational in September 2023 with an initial investment of 570 million RMB. This facility supports a range of packaging processes and has secured over 100 million RMB in orders, serving clients in the smart wear, RF chip, and mobile phone sectors. The company has successfully raised significant capital to fund its expansion, including a Series A round in September 2023 and a subsequent multi-hundred million RMB financing round in early 2025 to expand its production capacity.