Invotec

About Invotec

Amphenol Invotec operates as a European manufacturer of technologically complex printed circuit boards (PCBs), positioning itself as a key supplier for time-critical applications. The company's history traces back to the establishment of Forward Circuits in 1974 in Tamworth, UK. A series of acquisitions and a management buyout in 2001 led to the formation of the Invotec Group. In February 2015, the firm was acquired by Amphenol Corporation, a major American producer of electronic and fiber optic connectors, and was subsequently renamed Amphenol Invotec. This acquisition was a strategic move for Amphenol to expand its footprint in the European defense, aerospace, and industrial markets.

The company serves a global client base across demanding, high-reliability sectors including defense, aerospace, space, industrial, security, and transportation. A significant portion of its revenue, between 60% and 70%, is derived from the aerospace industry, with notable clients such as Rolls Royce and Thales, which has designated Amphenol Invotec as a strategic supplier. The business model is centered on supporting the entire product lifecycle, from design for manufacturability (DFM) and prototyping to serial production, effectively acting as an extension of its customers' engineering and manufacturing operations. Revenue generation is based on the production and sale of these advanced PCBs from its two UK manufacturing facilities in Tamworth and Telford.

Amphenol Invotec's product portfolio is extensive, covering a wide range of advanced PCB technologies. This includes multilayer boards with over 40 layers, High Density Interconnect (HDI), sequential lamination, and flex-rigid PCBs. The company utilizes advanced materials and offers specialized solutions such as thermal management, embedded components, and RF and microwave circuits. A key offering is its flex-rigid circuit technology, which integrates multiple PCB assemblies and eliminates the need for traditional wires and connectors by using a flexible substrate, allowing the board to conform to specific shapes during application. The firm's HDI capabilities range from single-level to complex 'Any Layer' HDI constructions, where all layers are high density, enabling free interconnection between conductors with copper-filled stacked microvia structures for highly complex devices. This technical expertise allows the company to cater to the miniaturization trends in electronics, delivering enhanced performance in smaller packages.