Hyperlume

About Hyperlume

Hyperlume Inc., established in 2022 by co-founders Mohsen Asad (CEO) and Hossein Fariborzi (CTO), is a deep-tech company addressing critical infrastructure limitations in the rapidly expanding artificial intelligence and high-performance computing (HPC) markets. The founders combined their expertise in electrical engineering and low-power circuit design to tackle the connectivity bottlenecks that hinder performance and drive up energy consumption in data centers.

The firm is focused on developing and commercializing a high-bandwidth, low-latency optical interconnect solution to replace traditional copper-based links. As AI models grow in complexity and data centers scale to hundreds of thousands of GPUs, existing copper interconnects are becoming a significant bottleneck, limiting data transfer speeds and consuming substantial power. Hyperlume's core technology utilizes specialized, ultra-fast micro-LEDs and ultra-low power circuitry to transmit data via light through a waveguide structure. This approach offers a step-change improvement in energy efficiency and performance, with the company claiming potential for 10 times the compute performance and five times the power savings compared to incumbent solutions.

Hyperlume operates within the optical interconnect market, which is projected to exceed $20 billion by 2028, driven by the demands of AI. The company targets hyperscalers, Tier-1 chip manufacturers, and AI infrastructure providers. Its business model is threefold, encompassing volume sales of optical interconnect products like active optical cables (AOCs), securing design wins with major hardware producers, and a licensing and integration model for co-packaged optics. A significant milestone was achieved in early 2025 with the closure of a $12.5 million seed funding round led by BDC’s Deep Tech Venture Fund and ArcTern Ventures, with notable participation from Intel Capital and LG Technology Ventures. This capital is being deployed to accelerate product development, expand the engineering and R&D teams, and prepare for the production of its 800G and 1.6T interconnects.