Garen Semiconductor

About Garen Semiconductor

Hangzhou Garen Semiconductor Co., Ltd. is a high-tech enterprise specializing in the research, development, production, and sale of ultra-wide bandgap semiconductor materials, primarily gallium oxide (Ga2O3). Founded in September 2022 and headquartered in Hangzhou, China, the company has strong affiliations with Zhejiang University's State Key Laboratory of Silicon and Advanced Semiconductor Materials. The research and development team, established in 2018 under the guidance of academician Yang Deren, has been a key driver of the company's technological advancements.

Garen Semiconductor's business model is centered on providing high-quality gallium oxide substrate products with independent intellectual property rights, holding over a dozen international and domestic invention patents. The company serves clients in the power electronics sector, including those in the national grid, new energy vehicles, rail transit, and 5G communications industries. Its product portfolio includes 2-inch to 8-inch gallium oxide single crystals and substrates, Vertical Bridgman (VB) crystal growth equipment, and homoepitaxial wafers. A key part of its strategy involves creating a full-chain product system spanning “equipment–crystal–substrate–epitaxy” to offer integrated solutions.

The company has achieved significant milestones, pioneering a self-developed casting method for gallium oxide single crystal growth. This has enabled the production of 6-inch and the world's first 8-inch gallium oxide single crystal substrates, a rapid progression from 2-inch wafers in just a few years. In June 2026, Garen announced it had established the world's first mass-production line compatible with both 6-inch and 8-inch homoepitaxial gallium oxide wafers, and has started delivering 6-inch wafers to leading chipmakers. This capability helps address previous industry limitations of small wafer sizes and poor uniformity, and is expected to lower substrate costs by over 80%.

Garen Semiconductor has secured multiple rounds of funding. This includes a Pre-A round in August 2024 led by Jiuzhi Capital and a Series A round in August 2026 co-led by Fangyuan Capital and Shenzhen Capital Group, involving a broad range of investors. The funds are aimed at expanding mass-production capacity for its 6- and 8-inch substrates and epitaxy to meet rising customer orders.