EoPlex Technologies

About EoPlex Technologies

EoPlex Technologies, founded in 2001 and headquartered in San Jose, CA, operates within the semiconductor manufacturing sector, providing additive manufacturing processes for semiconductor packaging. The company was established by Charles Taylor and later led by CEO Michael Loh Soon Gnee. Before its acquisition, EoPlex secured approximately $20.1 million in venture capital from investors including ATA Ventures, Draper Fisher Jurvetson Management, and Labrador Ventures. In a significant milestone, ASTI Holdings acquired EoPlex on February 1, 2012, integrating it as a subsidiary.

The core of EoPlex's business is its proprietary Configurable Sintered Interconnect (CSI™) platform, which utilizes 3D printing technology. This process involves depositing specialized metal and ceramic 'inks' to print package components onto a temporary stainless steel carrier that is removed after assembly and testing. This method serves as a smart alternative to traditional leadframe technology, targeting the growing demand for smaller and more cost-efficient semiconductor packages driven by the mobile, wearable, and IoT device markets. The business model appears to be B2B, focusing on designing and manufacturing electronic components for original equipment manufacturers (OEMs).

The CSI™ technology enables the production of ultra-thin packages, some less than 250µ thick, and supports high lead counts up to 500. A key benefit is the ability to produce electrically isolated devices on the strip, which facilitates more efficient strip testing at the final stage, reducing handling time and test costs. This allows for the use of Quad Flat No-lead (QFN) processing for packages that would typically require bulkier and more expensive options like Quad Flat Package (QFP) and Ball Grid Array (BGA). The technology's flexibility extends to multi-die and System-in-Package (SiP) applications, enhancing electrical and thermal performance while significantly reducing package size and cost.