Core Interconnect (Beijing) Technology

About Core Interconnect (Beijing) Technology

Core Interconnect (Beijing) Technology Co., Ltd. operates as a fabless semiconductor company focused on the design and development of high-performance, analog and mixed-signal chips. The company was established in December 2018, with its legal entity, Core Interconnect Technology (Qingdao) Co., Ltd., founded on December 7, 2018. Although its headquarters are in Qingdao, it maintains significant R&D centers in Beijing, Shanghai, and Chengdu.

The company was founded by Hu Kangqiao, who serves as the legal representative. Hu graduated from Tsinghua University with a bachelor's degree in electronic engineering and later earned a master's degree in electrical engineering, specializing in chip design, from Rice University in the United States. His professional background includes a role as a chip design engineer at AMD. The company's business strategy is modeled after Texas Instruments, aiming to build a comprehensive portfolio of analog and digital IP cores to create a "chip supermarket." This approach involves developing a wide range of individual chip products and then integrating these IPs into large-scale system-on-chip (SoC) solutions for servers and autonomous driving systems using Chiplet and System-in-Package (SiP) technologies.

Core Interconnect's product portfolio is extensive, featuring over a thousand mass-produced chip models. Key product categories include high-precision data converters (AD/DA), clock generators and buffers, SerDes interfaces, voltage reference sources, and operational amplifiers. These components are crucial for a variety of high-tech applications. The company serves a diverse client base across sectors such as power infrastructure, railway transportation, industrial manufacturing, servers, data centers, and personal computing. Revenue is generated through the sale of these semiconductor products to hundreds of enterprise clients.

The firm has demonstrated significant growth, securing substantial funding across multiple rounds. This includes a 50 million RMB seed round in February 2019, an A-round in May 2021, a multi-hundred million RMB B-round in April 2023, and a C-round of over 300 million RMB in August 2024. Key investors include prominent firms like CICC, China Merchants Capital, and Oriental Fortune Capital. This funding is directed towards accelerating R&D, expanding the product line, and attracting top talent to further its position in the domestic semiconductor market.