Core Intelligent Technology (Shanghai)

Core Intelligent Technology (Shanghai), operating as Chiplego, is a semiconductor startup founded in 2021 and headquartered in Shanghai, China. The company specializes in the development of modular semiconductor solutions based on chiplet technology, positioning itself within a rapidly evolving segment of the integrated circuit industry. The firm's core focus is on creating specialized chiplets for high-growth sectors, particularly the automotive and Artificial Intelligence (AI) markets. Chiplets are small, modular electronic chips or dies that can be assembled into a larger system, akin to building with LEGO bricks. This approach allows for heterogeneous integration, where different components on various manufacturing processes can be combined into a single package. This method provides greater flexibility, scalability, and potential cost advantages compared to traditional monolithic chip design, where the entire system is built on a single piece of silicon. Chiplego develops custom silicon accelerators and processors tailored for applications such as advanced driver-assistance systems (ADAS) in vehicles and AI inference workloads. The business model is centered on providing these advanced, customized semiconductor solutions to technology companies and manufacturers. By focusing on chiplet architecture, the company aims to address the increasing demand for high-performance, application-specific processors while navigating the complexities of the global semiconductor supply chain. Keywords: chiplet technology, custom silicon, semiconductor solutions, modular design, AI accelerators, automotive chips, heterogeneous integration, system-on-a-chip, advanced packaging, integrated circuits, Shanghai semiconductor, ADAS processors, die-to-die interface, compute chiplets, modular semiconductors, silicon innovation, AI hardware, automotive electronics, custom processors