Best Compound Semiconductor Co.

About Best Compound Semiconductor Co.

Established in August 2019, Best Compound Semiconductor Co. (also known as Nanjing Baishi Electronic Technology Co., Ltd.) operates in the third-generation wide-bandgap semiconductor industry from its research, development, and manufacturing headquarters in Nanjing, China. The company was co-founded by a team of seasoned experts, including CEO Xuan Rong, who holds a Ph.D. from Taiwan's National Chiao Tung University with a research focus on third-generation semiconductors. Before establishing the company, Xuan Rong gained extensive experience at the Industrial Technology Research Institute (ITRI) in Taiwan and later at electronics companies, where he led teams in the research, development, and mass production of GaN and SiC power devices.

Best Compound Semiconductor functions as a professional epitaxy foundry, specializing in the production and sale of silicon carbide (SiC) and gallium nitride (GaN) epitaxial wafers. Its business model is centered on providing high-quality manufacturing and foundry services to chip design firms, IDM (Integrated Device Manufacturer) companies, and other device foundries. The company's products are critical components for the power electronics and RF microwave application markets, serving high-growth sectors such as 5G communications and electric vehicles.

The firm offers a range of services, including SiC on SiC (SiC/SiC) epitaxy on 6-inch wafers and Gallium Nitride on Silicon (GaN/Si) on 6-inch and 8-inch wafers. It also provides Gallium Nitride on Silicon Carbide (GaN/SiC) services on 4-inch and 6-inch wafers. The company's products are engineered for high-voltage and high-power applications, supporting voltages from 650V up to and beyond 6500V. A key capability is the ability to produce wafers with a low density of surface defects, which directly impacts the yield and performance of the final devices. In addition to standard wafers, the company provides customized epitaxy services tailored to specific client needs.

Since its inception, the company has achieved significant milestones, including securing an investment partnership in November 2019 and starting production in the second half of 2021. It has successfully completed multiple funding rounds, including an A+ round in March 2024 and a Series B round in January 2025. By December 2024, the company had accumulated 37 patents. Its initial production line has an annual capacity of over 60,000 wafers, with plans for a second facility to further increase capacity.