ACCURACY

The company focuses on developing high-speed, high-precision, and intelligent semiconductor packaging equipment. Its core business provides advanced packaging solutions for clients in sectors such as integrated circuits (ICs), microwave components, high-speed optical modules, and MEMS sensors. ACCURACY's product portfolio includes multiple series of machines, such as die bonders and high-precision multi-function die attach systems, designed for various applications including IC packaging, System-in-Package (SiP), and multi-chip modules. The company leverages expertise in machine vision and motion control technology to serve its clients.

ACCURACY operates a modern manufacturing base and has established R&D and design centers. It has a significant domestic market presence with service centers in major Chinese technology hubs to provide sales and after-sales support. The company has formed strategic partnerships with prominent state-owned enterprises and technology leaders in China, including China Electronics Technology Group Corporation (CETC) and China Aerospace Science and Industry Corporation (CASIC). ACCURACY has received recognition as a national "Specialized, Refined, Special, and New" Little Giant enterprise, a designation for leading SMEs in strategic sectors.