3SP Group

About 3SP Group

Established with deep roots in French photonics research dating back to the 1980s, 3SP Group, through its operating entity 3SP Technologies, has a long and complex history of evolution within the high-tech optics sector. The company was officially founded in 1994 as Alcatel Optronics SA, a subsidiary of the Alcatel group. A significant milestone occurred in 2007 when Avanex France SA, its name at the time following a sale by Alcatel in 2003, was acquired by Alexandre Krivine, an expert in French high-tech ventures, alongside Didier Sauvage. This marked a pivotal turn towards its current operational focus. Over the years, the company has undergone several strategic acquisitions and capital changes, including becoming majority-owned by Eurazeo in 2011 and ultimately being acquired by O-Net Communications in March 2019, which formed the new 3SP Technologies.

3SP Technologies operates as a manufacturer of optoelectronic chips and modules designed for the telecommunications, industrial laser, and LiDAR markets. The firm is vertically integrated, leveraging its in-house III-V semiconductor chip technology to produce its components. This control over the manufacturing process, from epitaxial growth to packaging, allows it to serve as a key supplier for industries requiring advanced laser technologies. The business model involves both the sale of standardized products and the provision of foundry services, utilizing its specialized wafer processing expertise to create custom solutions for clients. Revenue is generated through the direct sale of these components and services to other technology companies and industrial manufacturers.

The company's product line is specialized, focusing on active optoelectronic components. This includes a wide array of pump laser modules for terrestrial and industrial applications, high-power seed laser modules for pulsed operations, and ultra-low power consumption Raman pump modules for amplification. It also produces and sells the core technology itself in the form of chips and chips on submount. These products are engineered to meet the Telcordia GR-468-CORE qualification, ensuring a high degree of reliability and performance for demanding applications.