3d Glass Solutions

About 3d Glass Solutions

3D Glass Solutions (3DGS) provides advanced packaging solutions for the semiconductor industry, specializing in the fabrication of electronic packages and devices using photo-definable glass-ceramics. The company was founded in 2005 by Jeb Flemming, who developed a technique to leverage glass ceramics for creating precise, 3D radio frequency (RF) passive components while working as a researcher at Sandia National Labs. Initially focused on life sciences under the name Life BioScience Inc., the company pivoted in 2014 to concentrate on high-frequency RF passive components, rebranding as 3D Glass Solutions. Flemming, currently the CTO, has an extensive background in applied technology and holds degrees in Chemical Engineering and an MBA in Management of Technology.

The company operates on a B2B model, providing design, prototyping, and high-volume production of glass-based, system-in-package (SiP) devices. Its business involves working closely with clients to adapt and optimize their designs for manufacturing with its proprietary APEX® Glass technology. Revenue is generated through these foundry services, catering to a global clientele that includes Tier 1 integrated circuit manufacturers, defense contractors, and photonic component suppliers. 3DGS targets markets such as wireless communications, aerospace and defense, photonics, high-performance computing (HPC), AI, and automotive radar.

3DGS's core offering is its patented APEX® glass-ceramic technology, which allows for the creation of high-precision products with low RF material loss and ultra-low transmission loss at high frequencies (1 to 200 GHz). The manufacturing process uses semiconductor lithography techniques to selectively turn parts of a glass substrate into a ceramic. These ceramic portions are then chemically etched to create intricate 3D microstructures, a method that is more versatile and cost-effective than using expensive lasers. This technology enables the production of passive components like antennas, filters, and inductors, and supports 3-Dimensional Heterogeneous Integration (3DHI), which involves stacking multiple glass layers to significantly reduce the size, weight, power, and cost (SWaP-C) of RF subsystems. Key investors include Intel Capital, Lockheed Martin Ventures, and Walden Catalyst Ventures, with significant funding rounds aimed at expanding its US-based manufacturing capacity in Albuquerque, New Mexico, and Richardson, Texas.